image:Thermal Conductive Material Tran-Q Clay

Thermal Conductive MaterialTran-Q Clay

Product features

This product fills narrow gaps and increases thermal conductivity and heat release

This thermal conductive product has a soft, clay-like texture. It is insulative and can be used in electronic equipment. It is not pumped out under high temperatures and does not contaminate the surroundings or nearby components. It is highly versatile and can easily fill 3D gaps, curved surfaces and complex spaces.

This product fills narrow gaps and increases thermal conductivity and heat release
  • High thermal conductivity
  • Excellent heat release performance
  • Reworkable
  • Can be formed at low load
  • 7:AFFORDABLE AND CLEAN ENERGY
  • 9:INDUSTORY,INNOVATION AND INFRASTRCTURE
  • 12:RESPONSIBLE CONSUMPTION AND PRODUCTION

Developers’ voice

High thermal conductivity

Development of a product that meets the recently growing need for thermal dissipation assistance

Development background

image:Highly effective in fire retardancy and insulation Highly effective in fire retardancy and insulation
image:NEW PRODUCTS DEVELOPMENT DEPT. NEW PRODUCTS DEVELOPMENT SECTION3 Hiroshi Umebayashi
image:NEW PRODUCTS DEVELOPMENT DEPT. NEW PRODUCTS DEVELOPMENT SECTION3 Shunichi Tsunajima

Electronic components are becoming increasingly downsized while ever more sophisticated, and the circuit board and motor coils dissipate greater heat. We started development to respond to the needs for heat dissipation. We commenced development starting from thinking freely, independent of conventional technology. For the development period of about two years, we sometimes spent a whole day on material formulation. So far, we have examined hundreds of variations of formulations. Products such as heat-dissipating sheets already exist in the market, while we focused attention on the fact that there was no flexible and easy-to-handle product. We developed a product that is softer and easier-to-handle than rubber.

The Tran-Q Clay is applicable only by placing the product between the heatsink and the unlevel surface of the device or board and by pressing it during assembly. It is highly transformable and its shape is retainable, simplifying the production process, thus shortening production hours. The product is low adhesion and the surface is not sticky. It can be installed efficiently on the assembly line. Even if assembly using this product fails, the product can be reused.

Thermal Conductive Material Tran-Q Clay
application examples

How Tran-Q Clay, the insulative, heat-dissipating product, changes with temperature.
Thanks to NOK’s unique technology, the product is not sticky on the surface and can be handled easily.

  • AXEL For purchase,please visit the AXEL website.
  • NOK For inquires, please contact here.
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